SemiEngineeringAdvanced Packaging's ProgressSemiEngineeringShim Il Kwon, CTO at STATS ChipPAC, sat down with Semiconductor Engineering to discuss the current and future trends of chip packaging. What follows are excerpts of that conversation. SE: The o …

SIA Engineering and Air India Engineering Services sign nonbinding MoUCAPA - Centre for AviationSIA Engineering Company Limited (SIAEC) and Air India Engineering Services Limited (AIESL), a wholly-owned subsidiary of Air India, entered (06-Oct-2017) a nonb …